We’ve had a number of questions about whether the Argentum can be used to make double sided or multi-layered boards. Although this is something we’ve always been confident is possible, we didn’t want to make any promises without thoroughly testing the possibilities first. After a few attempts, we’d like to present the very first fully operational, multi-layered board created with the Argentum!
There are a few different ways multi-layered boards could be made using the Argentum. The simplest would be to make two separate boards and connect them, using rivets or wire to bridge the sides. This is mechanically intensive and doesn’t lend itself well to automation so we tried to come up with better ways of doing it. Here is a multi-layered proof of concept of the SMT 555 timercircuit shown previously that uses solder to through-plate the vias.
Holes were made in the paper using a punch and filled with solder paste which was then reflowed with a hot air gun. This process is very easy and only adds a few minutes to assembly time.
We have plenty of other ideas on how to do this that should make it even easier in the future – let us know if you have any cool ideas you think would work.
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